Process
- RF components
- Chip & Wire Assembly
- Surface Mount Technology
- Chip On Board
- Multi-Chip Module
- Clean Room
- Hermetic Sealing
Packaging
- Flatpack, Quad Flatpack
- Pin Grid Array
- Ball Grid Array
- TO-5, TO-8
- Metal Tub
- Ceramic Chip Carrier
- Hybrid-DIP,SIP,SMT
Thick Film Print
- Multi-Layer
- Through Hole
- Solid Vias
- Double Sided
- Capacitors
- Resistors
Laser Trim
- Active Resistor Trim
- Passive Resistor Trim
- Capacitor Trim
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Die Attach
- Eutectic
- Epoxy
- Silver Glass
Bonding
- Automatic & Manual Gold Thermosonic
- Automatic & Manual Aluminum
- Manual Aluminum with up to
20 mil diameter wire
Sealing
- Seam Welding
- Gold-Tin
- Lead-Tin
- Ceramic Lid
- Conformal Coating
SMT
- Automatic Pick & Place
- Solder Reflow
- Double Sided
Test
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